VAPOUR PHASE REFLOW - PROFILING FOR LEAD FREE ALLOYS - ASSCON ADDRESSES THE PROFILING GAP WITH NEW THERMAL CONTROL TECHNIQUES TO ADDRESS THE ISSUE OF PROFILES MEETING PASTE MANUFACTURER RECOMMENDATIONS

摘要

Vapour Phase has seen resurgence in its use recently. In large part this has been a result of new chemistry and the advances in the technology to manage energy flow from the source to the PCB via the vapour. Added the demand from the customer base is again present as we deal with density challenges in PCB design, Parts design as well have to contend with new alloys that are less forgiving than the old traditional 63/37.