Integration of Diamond-like carbon and AIN for acoustic wave devices

摘要

The integration of diamond-like carbon (DLC) and piezoelectric AIN thin film for acoustic wave devices has been presented. Provided the high acoustic velocity and high thermal conductivity of DLC, the AIN/DLC/Si layered structure will outperform the traditional AIN/Si structure for acoustic wave devices. In this paper, the key issues including the deposition of DLC and AIN for implementing DLC based acoustic wave device have been experimentally investigated and surface acoustic wave resonators have been fabricated based on the AIN/DLC/Si layered structure.