Thermal management of IGBT module systems

摘要

This paper presents the thermal management of IGBT module with cooling fin. Among IGBT module materials, thermal compound has the worst thermal conductivity. Therefore, thermal compound thick-ness influences IGBT module thermal dispassion. At this time, we were investigated applies method of thin compound. Thermal compound printing with a newly designed metal stencil, we have achieved to reduce the thickness of thermal compound to about half and reduce the thermal resistance of IGBT module systems.