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INFLUENCE OF HEAT TREATMENT ON THE PROPERTIES OF HIGH THERMAL CONDUCTIVITY GRAPHITE COMPOSITES

机译:热处理对高导热率石墨复合材料性能的影响

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Thermal management is key to improving the performance and reliability of electronics systems. The use of 'traditional' packaging materials (e.g. aluminium and copper), limits conductive cooling efficiency, especially for high heat fluxes. This has driven development of 'third generation' high-performance materials which have ultra-high thermal conductivities, low coefficients of thermal expansion and low densities (1). Most of these materials incorporate carbon in some form. Natural crystalline graphite, with its high in-plane thermal conductivity and relatively low cost, is very attractive for thermal management. Foil materials are well-established, and anisotropic composites are marketed (e.g. for heat sinks), and continue to be developed. There are several examples of carbon-bonded materials in the literature. Mesophase pitch as a binder could, quite reasonably, be expected to produce the highest conductivity composites (2,3). However, factors of cost, availability and processing requirements, remain drivers to look at alternative binders.
机译:热管理是提高电子系统性能和可靠性的关键。使用“传统”包装材料(例如铝和铜)限制导电冷却效率,特别是对于高热量通量。这引起了具有超高热导体的“第三代”高性能材料的开发,热膨胀系数低,密度低(1)。这些材料中的大多数含碳以某种形式。自然晶体石墨,具有高面内导热率和相对较低的成本,对热管理非常有吸引力。箔材料是良好建立的,并且各向异性复合材料已销售(例如,用于散热器),并继续开发。文献中有几种碳键合材料的实例。作为粘合剂可以相当合理地产生最高导电性复合材料(2,3)的中间相沥青。但是,成本,可用性和处理要求的因素仍然是司机来查看替代粘合剂。

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