Atomic behavior at bonding interface of low temperature steel-to-steel solid state bonding

摘要

Solid-state bonding is materials weld processes, which create bonding below the melting point of constituent welding component. Since the actual bonding mechanism is still unclarified, high temperature, bonding pressure and long time are required [1], causing deteriorate effects to interface itself and constituents. From the studies of low temperature rollbonded interface between Type 304 stainless steel and Nickel [2], and solid state bonded interface of Interstitial Free (IF) steel [3], the interfacial strength evolution revealed distinct two stages, the first and the second stage. It was found that the interfacial strength increases rapidly in the first stage and slows down in the second stage. Along with interfacial strength evolution in the first stage, atomic rearrangement near interface was observed and incoherent interface gradually became coherent. Accordingly, the present study aims to clarify the movement of atoms, closed to interface, in the initial stage by Molecular Dynamics (MD) simulation.