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Effect of Cyclic Fatigue Damage Accumulation on the Elastic-Plastic Properties of SAC305 Solders

机译:循环疲劳损伤积累对SAC305焊料弹性性能的影响

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This study examines the effect of cyclic damage on the constitutive response of Sn3.0Ag0.5Cu (SAC305) solder material. Cyclic damage is induced through isothermal, mechanical cycling tests at high strain rate and room temperature, using a modified lap-shear microscale specimen (180 μm wide solder joint). The elastic, plastic, and yield response of the cycled solder joints are measured as a function of increasing cyclic damage, across various strain amplitudes. Significant piece-to-piece variability is observed in the measurements. This variability is consistent with previously reported viscoplastic measurements. Previous studies on the microstructure of solder in the initial state [1] and subsequent microstructural evolution due to cyclic damage [2] are summarized here to provide insights into the measured properties. The scatter in the measurements arises since as-reflowed SAC solder joints at length scales of 200 μm consist of only a few highly anisotropic grains of Sn [1-2]. This mechanically inhomogeneous microstructure results in anisotropic mechanical response that is dependent on the grain orientation in each specimen. The initial variability in the mechanical properties is seen to decrease with increasing cyclic damage, possibly due to the increasing homogenization caused by microstructural recrystallization [2]. These observations are indicative of the damage evolution we can expect in solder joints under life-cycle loading [3-9]. The elastic-plastic response and yield strength of SAC305 solder degrades with the accumulation of cyclic damage. The rate of degradation of the properties is proportional to the severity of the load cycle. The yield stress is observed to be equal in both the loading and unloading paths of each hysteresis loop, suggesting that SAC305 obeys an independent hardening rule, rather than the isotropic or kinematic hardening [10] which is reported. A continuum damage mechanics model based on Kachanov's damage description [11] is proposed, to describe the degradation in the constitutive properties as a function of cyclic load drop. The proposed damage model does a reasonably good job of capturing the degradation in plastic and yield properties. However, for elastic properties, the proposed damage model is effective only upto 25% of the life of most specimens tested. Possible reasons for the discrepancy are discussed in the paper.
机译:本研究探讨了循环损伤对SN3.0AG0.5CU(SAC305)焊料材料的组成响应的影响。使用改性的膝盖剪切微观标本(180μm宽焊点),通过高应变速率和室温,通过等温机械循环试验引起循环损伤。循环焊接接头的弹性,塑料和产量响应是在各种应变幅度上增加循环损伤的函数。在测量中观察到显着的碎片变异性。这种变异性与先前报告的粘性测量一致。以前关于初始状态[1]中焊料的微观结构的研究以及由于循环损伤引起的循环损伤[2]的随后的微观结构演化,以提供进入测量性质的见解。测量中的散射产生,因为在长度为200μm的长度尺度的回流烷焊缝中,仅由Sn [1-2]的少数非常各向异性晶粒组成。这种机械不均匀的微观结构导致各向异性机械响应,其取决于每个样本中的晶粒取向。由于循环损伤的增加,可能是由于由于由微结构再结晶引起的均质化增加而降低了机械性能的初始变异性。这些观察结果指示损伤进化我们可以在生命周期载荷下的焊点[3-9]中的焊点。 SAC305焊料的弹性塑料响应和屈服强度随着循环损伤的积累而劣化。性质的降解速率与负载周期的严重程度成比例。观察到屈服应力等于每个滞后回路的装载和卸载路径,表明SAC305 obeys是独立的硬化规则,而不是报道的各向同性或运动学硬化[10]。基于Kachanov损伤的连续损伤力学模型[11]提出,以描述根据循环负载下降的本构体特性的降解。拟议的损害模式在捕获塑料和产量性质的降解方面具有相当良好的工作。然而,对于弹性性质,所提出的损坏模型仅对测试的大多数标本的寿命的25%有效。本文讨论了差异的可能原因。

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