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High Reliability Microelectronics Packaging for Military Avionics Applications - (PPT)

机译:用于军事和航空电子应用的高可靠性微电子包装 - (PPT)

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Qualification Data by Necessity Often Pushed Beyond Interpolation Limits. Military & Avionic Needs Continue to Exceed Commercial Needs and Solutions. Desire to Close Cost Gap Exists and is Growing. Continued Off Shoring of Industry Exacerbates the Problem - Materials - People - Expertise. Continuing / Growing Need for Military Packaging - The Question is Where? Current High Volume Products Enabling a Microelectronics Packaging Center with Rockwell Collins.
机译:必要性的资格数据经常推动超出插值限制。军事和航空航空客人需求不断超过商业需求和解决方案。渴望关闭成本缺口并且正在增长。行业继续支持,加剧了问题 - 材料 - 人们 - 专业知识。持续/不断增长的军装需求 - 问题是在哪里?目前的高批量产品,使微电子包装中心与罗克韦尔柯林林。

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