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LOW MELT PAEK (LM PAEK) PREPREG FOR IMPROVED PROCESSING OF THERMOPLASTIC COMPOSITES

机译:低熔点PAEK(LM PAEK)预浸料,用于改进热塑性复合材料的加工

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Thermoplastic composite processing has advanced significantly in the past several years. Beginning with stamp forming of consolidated laminates, which can now be considered commonplace, the next level of the state-of-the-art is in-situ fiber placement. LM PAEK prepregs have arrived on the scene with the advantage of up to 55°C (131°F) lower processing temperatures and significantly lower viscosity compared to PEEK prepregs, while delivering similar performance. This translates into faster cycle times, lower costs and improved in-situ processing.LM PAEK prepreg material forms span the familiar architectures including fabrics, UD tape, slit UD tapes and fabrics, and chopped prepreg bulk molding compounds. TenCate's Cetex? TC1225 slit UD tape has been demonstrated to yield up to 200 mm/s automated fiber placement (AFP) deposition rates for near void free in-situ lamination with higher speeds anticipated in the near future. Much higher rates can also be run if the AFP process is followed by out of autoclave (OoA) consolidation to reduce porosity. The OoA consolidation step yields a laminate that is on par with automated tape laying (ATP).Producing design allowables and the qualification of any new material system for aerospace use is always an intense and costly process. TenCate is enabling the introduction of LM PAEK prerpeg by working with NCAMP to produce a publically available database for T700/TC1225 UD prepreg.
机译:热塑性复合处理在过去几年中提出了显着高。从盖上层压板的邮票形成开始,现在可以被认为是常见的,所以最先进的最先进的纤维放置。 LM PAEK预浸料坯已经到达现场,其优点在于高达55°C(131°F)的加工温度,与Peek Prepregs相比,粘度明显降低,同时提供类似的性能。这转化为更快的周期时间,降低成本和改进的原位处理。LM PAEK预浸料材料表格跨越熟悉的架构,包括织物,UD胶带,粘接UD胶带和织物,以及切碎的预浸料块成型化合物。 Tencate的Cetex?已经证明TC1225 SLIT UD胶带可以在不久的将来预期的速度较高的无效地原位层压,以达到高达200mm / s的自动化纤维放置(AFP)沉积速率。如果AFP过程之后,也可以运行更高的速率(OOA)固结以减少孔隙度。 OOA合并步骤产生了与自动胶带铺设(ATP)相对的层压板。生产设计允许和航空航天使用的任何新材料系统的资格始终是一种强烈且昂贵的过程。 Tencate通过使用NCAMP使用NCAMP来引入LM PAEK PRERPEG,以为T700 / TC1225 UD预浸料坯生成公开的可用数据库。

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