Solving In-Circuit Defect Coverage Holes with a Novel Boundary Scan Application

摘要

Virtual test access, offered by Boundary-Scan at In-Circuit Test (ICT), is insufficient for the challenges of next generation's high density Printed Circuit Boards (PCBs). The loss of test access translates to loss of defect coverage. This paper describes a novel use of existing technologies that increases the effectiveness of Boundary-Scan.