Board level validation for green IC packaging with strain-controllable dynamic bending method

机译：具有应变可控动态弯曲方法的绿色IC包装板级验证

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In the study, instead of electrical resistance monitoring in JEDEC JESD22–B111 for mechanical shock testing of handheld electronics, a proprietary strain-controllable dynamic bending method is applied to verify the effects of lead free SnAgCu solder ball with different dopant on the board level reliability of green TFBGA package.

机译：在研究中，代替JEDEC JESD22-B111中的电阻监测用于手持式电子设备的机械冲击测试，应用专有的应变可控动态弯曲方法，以验证无铅Snagcu焊球与不同掺杂剂对板级可靠性的影响绿色TFBGA包装。

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来源
《International Conference on Electronic Packaging Technology High Density Packaging》|2010年||共6页
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作者
Jeffrey ChangBing Lee; Chi-Ko Yu; Graver Chang; Tina Shao; Cherie Chen; Xiang-Kai.Meng; Brown Matt;
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原文格式 PDF
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中图分类 TN405-53;
关键词
Drop; Fine pitch; Halogen free; Lead free; Strain-controllable bending method;

机译：掉落;细腻;无卤素;无铅;应变可控的弯曲方法;

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Board level validation for green IC packaging with strain-controllable dynamic bending method

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