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Welding Failure Analysis of Tungsten-Copper Composite Material Used for Microwave Circuits

机译:微波电路钨铜复合材料焊接失效分析

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Due to have excellent thermal, electrical performance, W-Cu composite materials were wildly used in high-powery microwave devices and large-scale integrated circuits as the substrate, embedded blocks, connectors and heat dissipation devices. This paper aiming at the problem of welding failure between a batch of home-made W-Cu composite materials and the Kovar alloy when doing- microwave circuit welding. Compared with* to the import W-Cu composite materials, scanning -electron microscopy (SEM) and electron probe energy dispersive spectroscopy (EDS) were carried out on the microstructure and micro-area composition analysis. The poor welding causes of the materials were found. Through improved technology, increase the Cu content in the Cu-W composite material, and its weld ability with Kovar alloy was enhanced.
机译:由于具有优异的热,电性能,W-Cu复合材料在高功率微波器件和大型集成电路中被野外使用,作为基板,嵌入式块,连接器和散热装置。本文旨在在进行微波电路焊接时批量自制的W-Cu复合材料与Kovar合金之间的焊接失效问题。与*进口W-Cu复合材料相比,对微观结构和微区域成分分析进行扫描 - 电子显微镜(SEM)和电子探针能量分散光谱(EDS)。找到了材料的良差原因。通过改进的技术,增加Cu-W复合材料中的Cu含量,提高了Kovar合金的焊接能力。

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