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A Micro Milling Model Considering Metal Phases and Minimum Chip Thickness

机译:考虑金属阶段和最小芯片厚度的微铣模型

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摘要

In this paper, a micro milling model is brought forward. The influences of different metal phases and the minimum chip thickness are considered in the model. The cutting forces and the surface generation in the micro milling process are predicted. Through the experiment validation, the results correlate to the model very well.
机译:本文提出了一种微铣模型。模型中考虑了不同金属相的影响和最小芯片厚度。预测了微铣过程中的切割力和表面产生。通过实验验证,结果与模型相相关。

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