首页> 外文期刊>Journal of Micromechanics and Microengineering >Modelling and experimental analysis of the effects of tool wear, minimum chip thickness and micro tool geometry on the surface roughness in micro-end-milling
【24h】

Modelling and experimental analysis of the effects of tool wear, minimum chip thickness and micro tool geometry on the surface roughness in micro-end-milling

机译:建模和实验分析刀具磨损,最小切屑厚度和微型刀具几何形状对微端铣削表面粗糙度的影响

获取原文
获取原文并翻译 | 示例
       

摘要

Tool wear, minimum chip thickness and micro tool geometry are found to have a significant influence on the surface roughness through experimental analysis of the micro-end-milling process. To address these issues, a surface roughness model is developed and validated in this present work. Firstly, experimental analysis for the tool wear and surface roughness was performed based on the micro-end-milling experiments of OFHC Copper by using 0.1 mm diameter micro endmills with a miniaturized machine tool. The cutting velocity and material removal volume are found to have a great effect on the tool wear, which will in turn affect the surface roughness significantly. Then, a trajectory-based surface roughness model for micro-end-milling is proposed and proven capable of capturing the minimum chip thickness, micro tool geometry and process parameters. Finally, based on this model, a surface roughness model with tool wear effect is developed by taking the material removal volume and cutting velocity into account and is experimentally validated. This model accurately predicts the surface roughness variation with tool wear progress and provides the means for further process design and optimization studies of the micro-end-milling process.
机译:通过对微细铣削过程的实验分析,发现刀具磨损,最小切屑厚度和微型刀具几何形状对表面粗糙度有重大影响。为了解决这些问题,在本工作中开发并验证了表面粗糙度模型。首先,基于OFHC铜的微端面铣削实验,通过使用直径为0.1 mm的微型立铣刀和小型机床进行了刀具磨损和表面粗糙度的实验分析。发现切削速度和材料去除量对工具磨损有很大影响,这反过来将显着影响表面粗糙度。然后,提出了一种基于轨迹的微端铣削表面粗糙度模型,并证明了该模型能够捕获最小的切屑厚度,微型刀具几何形状和工艺参数。最后,基于该模型,通过考虑材料去除量和切削速度,开发了具有刀具磨损效果的表面粗糙度模型,并进行了实验验证。该模型准确预测了随刀具磨损进度而变化的表面粗糙度,并为进一步的工艺设计和微端面铣削工艺的优化研究提供了手段。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号