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A Novel Methodology for 3D Integration Using Multilayer Organics - (PPT)

机译：使用多层有机物的三维集成方法 - （PPT）

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LTLO presents new paradigm in packaging; LTLO represents highest component density as well as being halogen free; LTLO tailorable to LTCC line and PWB fabrication; Uniqueness in embedded offering: Integral RF substrate, Mixed Dielectrics, Embedded Dies and Surface Mounts; Full reliability testing to be completed by 5/15/08.

机译：LTLL在包装中展示了新的范例; LTLO表示最高的组分密度以及自由卤素; 符合LTCC线和PWB制造的LTLO; 嵌入式产品中的唯一性：整体RF基板，混合电介质，嵌入式模具和表面贴装; 完整的可靠性测试将于5/15/08完成。

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《SMTA 3D/SiP Advanced Packaging Symposium 》|2008年||共40页
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S. Dalmia; G. White; L. Carastro; V. Sundaram; C. Russell; M. Swaminathan;
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A Novel Methodology for 3D Integration Using Multilayer Organics - (PPT)

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