3D process technologies enable new platforms for highly integrated multifunctional Microsystems; High density 3D integration provides opportunity for unprecedented performance in individual subsystems; Massively parallel signal processing for increased functionality and on-chip decision making in high performance sensor systems; Process for 3D integrated FPAs has been verified with test IR FPAs; Excellent electrical interconnect operability; No image artifacts or excess noise in 256×256 MWIR FPAs; Robust to thermal cycling stress; Cu-based metal-metal bonding systems are augmenting traditional solder bump techniques for fine pitch interconnects; 3D enabled passives with enhanced performance are suitable for incorporation on stackable interposers; While many challenges remain, "3D System-on-a-Chip" is becoming a viable platform for volume-, weight-and power-restricted applications.
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