BGA Component Thermal Warpage And Implication For Interconnect Reliability-(PPT)

机译：BGA分量热翘曲和互连可靠性的含义 - （PPT）

获取原文

页面导航

摘要
著录项
相似文献
相关主题

摘要

Shadow moire for warpage measurement. Features of thermal warpage of BGA of different types. Mechanism for BGA thermal warpage. Implication of BGA warpage for solder joint reliability.

机译：翘曲测量的影子莫尔。不同类型的BGA热翘曲的特点。 BGA热翘曲的机制。 BGA翘曲对焊点可靠性的影响。

著录项

来源
《International Conference on Soldering Reliability》|2007年||共43页
会议地点
作者
Hua Lu;
展开▼
作者单位

展开▼
会议组织
原文格式 PDF
正文语种
中图分类 TG4-53;
关键词

相似文献

外文文献
中文文献
专利

1. Experimental/Numerical Analysis of Thermally Induced Warpage of Ultrathin Chip-on-Flex (UTCOF) Interconnects [J] . Lu S.-T., Chen W.-H. Components and Packaging Technologies, IEEE Transactions on . 2010,第4期

机译：超薄挠性芯片（UTCOF）互连件热致翘曲的实验/数值分析
2. Impact of Isothermal Aging and Testing Temperature on Large Flip-Chip BGA Interconnect Mechanical Shock Performance [J] . Lee Tae-Kyu, Chen Zhiqiang, Guirguis Cherif, Journal of Electronic Materials . 2017,第10期

机译：等温老化和测试温度对大型倒装芯片BGA互连机械冲击性能的影响
3. Experimental and Modeling of the Stress-Strain Behavior of a BGA Interconnect Due to Thermal Load [J] . Yan Zhang, Johan Liu, Ragnar Larsson Journal of Electronic Packaging . 2008,第2期

机译：热负荷导致BGA互连件应力-应变行为的实验和建模
4. BGA Component Thermal Warpage And Implication For Interconnect Reliability-(PPT) [C] . Hua Lu International Conference on Soldering Reliability . 2007

机译：BGA分量热翘曲和互连可靠性的含义 - （PPT）
5. Microstructure based experimental and finite element analysis of failure mechanism of lead-free BGA interconnects [D] . Dhakal, Ramji 2008

机译：基于微结构的无铅BGA互连失效机理的实验和有限元分析
6. A Model of BGA Thermal Fatigue Life Prediction Considering Load Sequence Effects [O] . Weiwei Hu, Yaqiu Li, Yufeng Sun, 2016

机译：考虑载荷顺序影响的BGA热疲劳寿命预测模型
7. Creep Damage of BGA Solder Interconnects Subjected to Thermal Cycling and Isothermal Ageing [O] . Joshua A. Depiver, Sabuj Mallik, Dani Harmanto, 2019

机译：BGA焊料互连受热循环和等温老化的BGA焊料互连损坏
8. Quality and Reliability of BGA and SMT Components [R] . Ghaffarian, R. 1996

机译：BGa和smT元件的质量和可靠性

BGA Component Thermal Warpage And Implication For Interconnect Reliability-(PPT)

摘要

著录项

相似文献

相关主题

期刊订阅