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Metrology for Emerging Materials, Devices, and Structures: The Example of Graphene

机译:新出现的材料,装置和结构的计量:石墨烯的例子

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New switches are being designed based on carrier spin, excitons, and other properties. Graphene is considered a strong candidate for many of these applications. New phenomena abound at nanoscale dimensions, and graphene is no exception. Quantum confinement impacts materials properties and measurement itself. Berry Phase corrections to carrier transport measurements are widely recognized. New materials such as graphene are difficult to find, manipulate, and measure. One key question is the number of graphene layers in a sample and the stacking of multilayer samples. Multiple characterization methods are necessary including transmission electron microscopy (TEM), Low Energy Electron Microscopy (LEEM), nano-Raman, and several scanned probe methods. Multislice simulations are a useful guide in determining TEM capability and imaging conditions. Initial simulation work points to the ability to distinguish stacking patterns. Recent work indicates that LEEM can determine the number of layers and the morphology of a graphene sample.[1] Raman provides an excellent means of determining the number of layers in a stack of graphene. Single electron transistors have mapped electron-hole puddles across a sample area.[2] Quantum confinement and Berry Phase corrections are two examples of quantum phenomena that alter the properties of nano-scale structures.[3] Optical and electrical properties must be understood before they are measured. This paper will cover the research and development of metrology for CMOS Extension and Beyond CMOS using graphene as an example.
机译:基于载体旋转,激子和其他性质设计新开关。石墨烯被认为是许多这些应用的强烈候选者。纳米尺寸比比皆是,石墨烯也不例外。量子限制会影响材料性质和测量本身。广泛认可对载波运输测量的浆果相校正。诸如石墨烯等新材料难以找到,操纵和测量。一个关键问题是样品中的石墨烯层的数量和多层样品的堆叠。需要多种表征方法,包括透射电子显微镜(TEM),低能量电子显微镜(Leem),纳米拉曼和几种扫描探针方法。 MultiSlice模拟是确定TEM能力和成像条件的有用指南。初始模拟工作指向区分堆叠模式的能力。最近的工作表明,Leem可以确定层数和石墨烯样品的形态。[1]拉曼提供了确定石墨烯堆叠中的层数的优异方法。单电子晶体管在样品区域覆盖电子孔坑。[2]量子限制和浆果相位校正是改变纳米尺度结构的性质的量子现象的两个例子。[3]在测量它们之前必须理解光学和电气性能。本文将涵盖使用石墨烯作为示例的CMOS延伸和超越CMOS的研究和开发。

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