首页> 外国专利> Microchip for use in computer, comprises heat dissipating enclosure containing graphene which is embedded into wrapping material and graphene structures that are grown on material of microchip which is wrapped with graphene structure

Microchip for use in computer, comprises heat dissipating enclosure containing graphene which is embedded into wrapping material and graphene structures that are grown on material of microchip which is wrapped with graphene structure

机译:用于计算机的微芯片,包括散热外壳,该散热外壳包含嵌入包裹材料中的石墨烯和生长在包裹有石墨烯结构的微芯片材料上的石墨烯结构

摘要

The microchip (13) has a heat dissipating enclosure (16) containing graphene which is embedded into a wrapping material. The graphene structures (19) are grown on material of microchip which is wrapped with graphene structure (15). The graphene structures are extended away from outside of enclosure. The graphene structures (15,18) are connected to microchip through substrate (11). The recesses such as holes (22) are filled with graphenes. The microchip is formed as a sandwich construction consisting of graphene structures and wafer material.
机译:微芯片(13)具有包含石墨烯的散热外壳(16),该散热外壳被嵌入包装材料中。石墨烯结构(19)生长在包裹有石墨烯结构(15)的微芯片材料上。石墨烯结构从外壳的外部延伸开。石墨烯结构(15,18)通过衬底(11)连接到微芯片。诸如孔(22)的凹陷填充有石墨烯。微芯片形成为由石墨烯结构和晶片材料组成的夹心结构。

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