MICROSTRUCTURAL CHANGE OF Sn/37Pb AND Sn/3Ag/0.5Cu SOLDER ALLOYS SUBJECTED TO UNIAXIAL RATCHETTING DEFORMATION

摘要

Ratchetting deformations of solder alloys are significant deformations for the safety and reliability of solder joints of electronic packaging. In this paper, the microstructural change of the solder alloys due to the uniaxial ratchetting deformation is evaluated to clarify the effect of the microstructure on the viscous deformation of solder alloys. The microstructures are observed after the specimens are subjected to the uniaxial ratchetting deformation during several cycle numbers. The change of the size of grains or lamella structures is used to evaluate the uniaxial ratchetting deformation of solder alloys. The observation clarifies that the differences in the microstructural change due to the uniaxial ratchetting deformation between the lead-free and lead-containing solder alloys. The uniaxial ratchetting deformation and the additional creep deformation after the ratchetting deformation is also simulated by the dislocation based constitutive model. The simulation suggests that the material parameters used in the constitutive model may be correlated to the microstructural change of the solder alloys.