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Integration of femtosecond laser fabricated optical waveguides and microfluidic channels for lab-on-chip devices

机译:用于实验室装置的飞秒激光制造光波导和微流体通道的集成

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A lab-on-chip (LOC) is a device that squeezes onto a single substrate the functionalities of a biological laboratory, by incorporating a network of microfluidic channels, reservoirs, valves, pumps and micro-sensors. Its main advantages are high sensitivity, speed of analysis, low sample and reagent consumption, and the possibility of measurement automation and standardization. The next technological challenge of LOCs is direct on-chip integration of photonic functionalities, by adding optical waveguides. Such integrated approach has many advantages over traditional free-space optical sensing, including compactness and portability, enhanced sensitivity and possibility of parallel excitation at multiple points in the microfluidic channel. Standard fabrication technologies for microchannels and optical waveguides are multistep processes and their integration is rather complicated, strongly limiting its application. Femtosecond-laser inscription of optical waveguides in glass is a powerful technique enabling single-step, three-dimensional fabrication [1], and appears to be particularly suited for their integration into LOCs. In addition, femtosecond-laser irradiation of fused silica followed by chemical etching in HF solution allows the manufacturing of microfluidic channels [2]. This opens the intriguing possibility of using a single laser system for the fabrication of both microfluidic channels and optical waveguides and also gives the capability of a real three-dimensional integration of the two structures.
机译:上实验室芯片(LOC)是挤压到一个单一的衬底上的生物实验室的功能,通过将微流体通道,水库,阀门,泵和微型传感器网络的设备。其主要优点是高灵敏度,分析,低的样品和试剂的消耗速度,和测量自动化和标准化的可能性。交通线的下一个技术挑战是直接的片上集成的光子功能性,通过增加光波导。这种集成方法具有比传统的自由空间光学感测,包括紧凑性和便携性,增强的灵敏度并在微流体通道的多个点并行激励的可能性许多优点。对于微通道和光波导标准制造技术是多步流程及其集成比较复杂,强烈限制了其应用。在玻璃光波导的飞秒的激光题字是一个功能强大的技术实现了单步,三维制造[1],并且似乎特别适合于将其纳入LOC的。此外,熔融二氧化硅的飞秒激光照射,然后在HF溶液中的化学蚀刻允许制造微流体通道[2]的。这将打开使用单一激光系统两个微流体通道和光波导的制造的有趣的可能性,并且还给出了两种结构的真实三维集成的能力。

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