THE EFFECT OF IMPURITIES ON CELL PERFORMANCE AND ON THE QUALITY OF ELECTRODEPOSITS OBTAINED AT HIGH CURRENT DENSITY IN A COPPER ELECTROWINNING CELL BASED ON REACTIVE ELECTRODIALYSIS

摘要

Chemical and physical characterization of copper electrodeposits obtained on mesh and plate cathodes in conventional and reactive electrodialysis lab-scale cells have been carried out. The effect of Fe, Mn, Cl and guar on electrodeposit composition and morphology were determined by means of metallographies, scanning electron microscopy (SEM), atomic force microscopy (AFM), inductively coupled plasma mass spectrometry (ICP-MS) and Auger electron spectroscopy (AES). Each impurity influenced the deposit morphology in a different way (e. g. grain size, surface roughness). AFM proved to be a very effective tool for quantifiying and classifiying surface quality.