The Surface Quality of Monocrystalline Silicon Cutting Using Fixed Abrasive Diamond Endless Wire Saw

摘要

This article investigates the cutting of monocrystalline silicon using a fixed abrasive diamond endless wire. The cut surface of monocrystalline silicon is studied. The wire speed is higher, the surface quality is better. And monocrystalline silicon was removed in a brittle regime mainly. The effect of wire speed and feed rate on surface roughness is investigated. This study demonstrates the advantage of fixed abrasive diamond endless wire cutting of monocrystalline silicon.