首页> 外文会议>NATO Advanced Research Workshop on Defects in Advanced High-k Dielectric Nano-Electronic Semiconductor Devices >DEFECT AND COMPOSITION ANALYSIS OF AS-DEPOSITED AND NITRIDED (100)SI/SIO_2/HF_(1-X)SI_XO_2 STACKS BY ELECTRON PARAMAGNETIC RESONANCE AND ION BEAM ANALYSIS
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DEFECT AND COMPOSITION ANALYSIS OF AS-DEPOSITED AND NITRIDED (100)SI/SIO_2/HF_(1-X)SI_XO_2 STACKS BY ELECTRON PARAMAGNETIC RESONANCE AND ION BEAM ANALYSIS

机译:通过电子顺笔谐振和离子束分析,缺陷和渗透和氮化(100)Si / SiO_2 / HF_(1-X)Si_XO_2堆叠的缺陷和成分分析

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The defects in the as-deposited and nitrided Si/SiO_2/Hf_(1-x)Si_xO_2 stacks have been analysed by EPR spectroscopy. The interface defects at the Si/SiO_2 section are identical to those in the classical Si/SiO_2 case and their concentration is not influenced by the hafnium silicate layer growth. Asdeposited hafnium silicate layers present in addition a defect located in the near surface region with a high concentration; it shows the characteristics of the EX center in SiO_2 including low temperature hydrogen passivation. In the nitrided samples both the interface defects and the EX center are no longer observed. Additional annealing shows this to be related to a hydrogen passivation during the nitridation. The composition of the as deposited Hf_(1-x)Si_xO_2 layers have been analysed by ion beam analysis. Their thermal nitridation by NH_3 has been investigated as a function of the annealing conditions. The hafnium silicate layers incoporate N up to some at% in the entire layer whereas hafnium oxide layers show no significant nitrogen incorporate into the bulk of the film.
机译:通过EPR光谱分析了沉积的沉积和氮化Si / SiO_2 / HF_(1-X)Si_XO_2堆叠的缺陷。 Si / SiO_2部分的界面缺陷与经典Si / SiO_2案例中的界面缺陷相同,并且它们的浓度不受氟酸铪层生长的影响。添加铪硅酸铪层另外,缺陷位于近浓度的近表面区域中;它显示了SiO_2中的EX中心的特性,包括低温氢钝化。在氮化样本中,不再观察到界面缺陷和EX中心。额外的退火表明,这与氮化过程中的氢钝化有关。通过离子束分析分析了作为沉积的HF_(1-x)Si_XO_2层的组成。通过NH_3的热氮化被研究是作为退火条件的函数。铪硅酸盐层在整个层中加速为1%,而氧化铪层显示出没有明显的氮掺入其中大部分膜。

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