Advanced Design Techniques to Support Next Generation Backplane Links Beyond 10Gbps

摘要

Copper backplane links are typically designed to support multiple generations of upgradeable plug-in modules with successive increases in line speed. Choices around cost, density, and risk must be made to facilitate this upgrade path, while maintaining cost effectiveness and reliability for the immediate market requirements. Progress is being made on various specifications for Ethernet, Fibre Channel, and other protocols that are expected to exceed 10 Gbps. Consequently, system designers are evaluating channels that support 20+ Gbps. This paper investigates advanced design techniques including alternative plated-through-structures (PTH) for connector attachment, advanced shielding technologies, and novel approaches to mitigate mode conversion effects.