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Development of a New Electroplating Process for Hard Ni-W Alloys

机译:开发硬镍氢合金新型电镀工艺

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Fabrication of tools for micro-injection molding performed by electroforming of Ni-W alloy is proposed. Influences of complexing agents, which enable the Ni-^sW co-electrodeposition, on the process properties are critical. We optimized the complexing agents in the electrolyte for obtaining high current efficiency (>80%) and low residual stress in the deposit. The thermal stability of the Ni-W layer deposited from the new electrolyte is also investigated. Hardness of the Ni-W deposit (W=6 at. %) increased by annealing at temperatures up to 550°C. This indicates that the Ni-W material can be useful also for injection molding of polymers such as PEEK, with high glass-transition temperature. To a certain extent the Ni-W alloy could also be used as a replacement for hard chromium plating.
机译:提出了通过Ni-W合金的电铸进行的微注射成型工具的制造。络合剂的影响,即Ni-^ Sw Co-Exterpostion在工艺性质上是至关重要的。我们优化了电解质中的络合剂,以获得高电流效率(> 80%)和沉积物中的低残留应力。还研究了从新电解质沉积的Ni-W层的热稳定性。通过在高达550℃的温度下退火,Ni-W沉积物(W = 6at)的硬度增加。这表明Ni-W材料也可用于注射聚合物如PEEK,具有高玻璃化温度。在一定程度上,Ni-W合金也可以用作硬铬电镀的替代品。

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