This paper will present seven different materials used for the production of both wave solder and reflow solder pallets. The goal of this study will be for the purpose of depicting machining capabilities for depth, wall thickness, and accuracy of machining for each of the seven materials presented. Additionally, a lead free wave pallet (used for a high running Printed Circuit Board (PCB) product) will be built out of each of the materials being tested. Each pallet will be tested for the purpose of showing long-term wear effects over multiple heat cycle run times; monitoring pallet flatness for heat warping of the pallet; wall thickness changes; and, overall changes in surface condition. For the purposes of this study, each of the materials used is listed in terms of basic material properties.
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