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High Strain Rate Characterisation of a Polymer Bonded Sugar

机译:聚合物键合糖的高应变率表征

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摘要

The mechanical properties of a polymer bonded sugar consisting of 78% sugar crystals, of modal particle size 310 μm, dispersed in an HTPB binder have been characterized in a split Hopkinson pressure bar system at a strain rate of 103 s–1 and temperatures from –100 to +20 °C. These high rate experiments were supplemented by further experiments in an Instron at 10–3 s–1. The material behavior is compared to that of other polymer bonded explosives and simulants. In order to further understand the structural deformation mechanisms specimens of both pristine material and that after Instron testing were examined using X-ray microtomography.
机译:由78%糖晶体组成的聚合物键合糖的机械性能,其中模粒粒度为310μm,分散在HTPB粘合剂中,以103 S-1的应变率和来自 - 的温度)特征在于HOTPB粘合剂中的分散霍普金森压力条系统。 100至+20°C。通过在10-3 s-1的Instron中进一步的实验补充了这些高速率实验。将材料行为与其他聚合物键合炸药和模拟剂的行为进行比较。为了进一步了解原始材料的结构变形机制,并且使用X射线显微镜检查进行Instron测试后。

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