This paper presents a thermal analysis result for a novel 3D heterogeneous integrated platform MorPACK (morphing package). The MorPACK platform is stacked by heterogeneous sub-modules composed of bare dies, a substrate, connection substrates, and solder balls. Since this platform owns the tiny, heterogeneous and integrable characteristics, the fabrication structure becomes high-density and laminar, thus, forced convection is incapable. In order to improve the cooling conditions of MorPACK platform, we bring up three indications to optimize the thermal solution. First, the out-planar thermal resistance can be improved by filling up whole MorPACK with mold material. Second, the bare die chip with highest power consumption should be placed on the lowest layer of this 3D structure because the lowest layer owns the best cooling conditions. Third, removing connection substrates and cutting out part of the substrate to make a room space for chip placement. With result shown, the difference of maximum and minimum chip temperature of the system becomes smaller while 50% height and volume of MorPACK can be minimized.
展开▼
