IMAPS Global Business Council Roadmap Process: 'The Road Ahead' - (PPT)

摘要

Develop Feasible Embedded Components. Develop Enhanced Materials to Enable Wafer Level Packaging. Bring Solutions to Resolve Thermal Management Issues. Develop New Materials to Reduce System Cost While Delivering the Necessary Performance. Close the Gap Between Chip and Substrate Interconnect Density. Resolve the issues low K and Cu bring to Packaging.