NOVEL CONCEPTS TO DELIVER HIGH YIELD X3D-IC PACKAGING BASED ON WAFER SCALE STACKING - (PPT)

机译：基于晶圆尺度堆叠的高产X3D-IC包装提供高产X3D-IC包装的新颖概念 - （PPT）

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MFT technology is disruptive for the IC Industry. MFT is an enabler to other industries. It's hard to believe, but MFT stack of Stack invention achieves nearly 100% yield. It can achieve >100 times density increase without having to invest in 90nm to 22nm.

机译：MFT技术对IC行业具有破坏性。 MFT是其他行业的推动者。很难相信，但MFT堆栈发明的堆栈发明率近100％。它可以实现> 100倍的密度增加，而无需投资90nm至22nm。

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《International Conference and Exhibition on Device Packaging》|2008年||共32页
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Sadeg M. Faris;
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中图分类 TN405.94-53;
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3. Transient and crosstalk analysis of slightly lossy interconnection lines for wafer scale integration and wafer scale hybrid packaging-weak coupling case [J] . Kim J., McDonald J.F. IEEE Transactions on Circuits and Systems . 1988,第11期

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4. NOVEL CONCEPTS TO DELIVER HIGH YIELD X3D-IC PACKAGING BASED ON WAFER SCALE STACKING - (PPT) [C] . Sadeg M. Faris International Conference and Exhibition on Device Packaging . 2008

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NOVEL CONCEPTS TO DELIVER HIGH YIELD X3D-IC PACKAGING BASED ON WAFER SCALE STACKING - (PPT)

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