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The Recessed Probe Launch - A New Signal Launch for High Frequency Characterization of Board Level Packaging

机译:嵌入式探头发射 - 用于高频表征板级包装的新信号发射

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Characterization of printed circuit board structures such as embedded transmission lines and vias has relied on coaxial connectors or surface probing with high frequency microwave probes to provide interfaces to test equipment. Both approaches require vias to access internal layers which can severely distort high frequency behavior of the structure being measured. This paper describes a different access technique that allows a clean launch directly from microwave probes into a stripline structure. The quality of the launch is sufficient to permit characterization of small structures to frequencies of 40GHz. This technique now allows each segment of an electrical net to be decomposed into individual canonical elements with uniform interfaces. These elements can then be used to synthesize S-parameters for a general class of nets based on experimental data.
机译:诸如嵌入式传输线和通孔的印刷电路板结构的表征依赖于同轴连接器或具有高频微波探头的表面探测,以提供测试设备的接口。这两种方法都需要VERS访问内部层,这可能严重扭曲正在测量的结构的高频行为。本文介绍了一种不同的接入技术,允许将微波探针直接从微波探测到带状线结构。发射的质量足以允许对40GHz的频率表征小结构。该技术现在允许电网的每个段被分解成具有均匀界面的单个规范元件。然后可以使用这些元件基于实验数据合成用于一般净网络的S参数。

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