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Chip-level Power Integrity Methodology for High-Speed Serial Links

机译:高速串行链路的芯片级功率完整性方法

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摘要

A methodology for chip level power integrity analysis is presented. The approach accurately estimates the jitter induced on a victim block due to the current of an aggressor block through the power distribution network and linear voltage regulators. The analysis relies on simple stand-alone simulations of different blocks while the system-level analysis is completed by combining the results analytically. This procedure allows different designers to perform fewer and quicker simulations and as a result, there can be many iterations of the power integrity analysis to find the optimal solution. For example, the analysis can drive decisions regarding die capacitance partitioning and/or requirements for regulation on various circuit blocks.
机译:提出了一种芯片级功率完整性分析的方法。该方法由于通过配电网络和线性电压调节器的侵略者块的电流,请准确估计在受害块上引起的抖动。分析依赖于通过分析结果结合结果完成的不同块的简单独立模拟。此过程允许不同的设计者执行较少且更快的模拟,因此,可以有很多迭代电源完整性分析来查找最佳解决方案。例如,分析可以驱动关于芯片电容分区和/或对各种电路块的调节要求的决定。

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