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Residual Stresses in TiO2 Anatase Thin Films Deposited on Glass, Sapphire and Si Substrates

机译:TiO2锐钛矿薄膜中的残留应力沉积在玻璃,蓝宝石和Si基板上

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Anatase-TiOi films (thickness 100-1000 nm) were grown on glass, sapphire,>and Si(100) substrates using pulsed dc-magnetron reactive sputtering. By measuring the curvature of substrates before and after the thin film deposition, the residual stresses were determined. These results clearly show that the bi-axial stresses are compressive type and decreases with the increasing film thickness. The Raman spectra of these films were measured with two different excitation wavelengths (514 and 785 nm) and the thickness dependent shifts of Eg phonon mode were studied. The dominant 144 cm"1 Egmode in TiCh anatase clearly shifts to a higher value by 0.45 to 17.4 cm"1 depending on the type of substrate and the thickness of the film. Maximum shift was seen for the films on glass substrate indicating a higher bi-axial compressive stress in agreement with the curvature measurements. The excitation wavelength dependent shift of Eg mode clearly shows that the bi-axial stress increases along the film depth, being larger at the film/substrate interface.
机译:使用脉冲DC-Magnetron反应溅射在玻璃,蓝宝石,>和Si(100)基板上生长锐钛矿 - TiOi薄膜(厚度100-1000nm)。通过测量薄膜沉积前后基材的曲率,测定残余应力。这些结果清楚地表明,双轴应力是压缩型并且随着薄膜厚度的增加而降低。用两种不同的激发波长(514和785nm)测量这些膜的拉曼光谱,并且研究了例如声子模式的厚度依赖性偏移。根据基板的类型和薄膜的厚度,TICH anatase中的显着144cm“1 eGMode明显地转移到更高的值0.45至17.4cm”1。对于玻璃基板上的薄膜,可以看到最大移位,其表明与曲率测量相一致的双轴压缩应力。例如模式的激发波长依赖性偏移清楚地表明,双轴应力沿着薄膜深度增加,在薄膜/衬底界面处更大。

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