Development of Stress Analyzer Using Whole Back Reflection Ring

摘要

The X-ray stress measurement based on (sinψ){sup}2 method has been widely adopted This technique is not entirely efficient, because it is necessary to measure each diffraction profile one after other at five and more incident X-ray angles. On the other hand, stress measurement based on cosα method was proposed using X-ray film as detector. In this method, the stresses are determined from Debye-ring obtained at single X-ray incident angle with high efficiency. However, it has the problem in this accuracy on stress determination. In this study, a new stress analyzer with sixteen Position Sensitive Proportional Counters (PSPC) arranged radially for incidence X-ray is developed. We examined to determine the plane stress components by multi-regression analysis using sixteen diffraction angles on Debye-ring. As the result, it was clarified that this analyzer enables to measure σ{sub}x and τ{sub}(xy) with sufficient accuracy. And then, we discussed on σ{sub}y measurement accuracy.