首页> 外文会议>American Society for Engineering Education Annual Conference and Exposition >An Exact Analysis for Freeze-out and Exhaustion in Single Impurity Semiconductors
【24h】

An Exact Analysis for Freeze-out and Exhaustion in Single Impurity Semiconductors

机译:单一杂质半导体中冻结和耗尽的精确分析

获取原文

摘要

In this paper, a complete analytical description for an exact expression for temperature dependence of the majority carrier in a single-impurity, equilibrium semiconductor is proposed. Analysis establishes that the problem is solvable exactly by identifying the only physically possible root to a cubic equation. This model provides an attractive alternative to approximate standard classroom approaches for this topic covered in senior and first year graduate level solid state courses in physics and electrical engineering. Integrated circuits (ICs) are specified to operate between designated temperature limits. The circuit designer selects the doping level or levels and typically assumes that the dopants are approximately 100% ionized, i.e., exhaustion of dopant and the temperature is not too high. There can be a significant impact on the values for a plethora of device parameters, such as depletion width or a field effect transistor (FET) threshold voltage, if the assumption is violated. If the temperature is too low, the percentage ionization of dopant or dopants will be significantly less than 100%. This reversal of the high percentage of ionization of the dopant is commonly referred to as freeze-out. Most semiconductor devices and ICs are designed to be operated in exhaustion regime also known as "extrinsic regime" see Figure 1, borrowed from B. Streetman’s classic undergraduate text book, for which the majority carrier concentration is approximately equal to the dopant concentration e.g. N{sub}D=10{sup}15/cm{sup}3. Again, in reference to Fig. 1, if the temperature is too high, the thermal generation effect causes the majority carrier concentration to become excessively higher than the dopant in what is called the intrinsic temperature regime. In the intrinsic regime, the majority carrier concentration is approximately the intrinsic concentration, n{sub}i. The exhaustion regime lies between theses two extremes, intrinsic and freeze-out. The semiconductor designer will be interested in the temperature dependence of the majority carrier. As on Fig. 1, this dependence is often represented as a log-plot of the majority carrier concentration versus reciprocal of the temperature, T.
机译:在本文中,提出了一种完整的分析描述,用于在单杂质,平衡半导体中大多数载体的温度依赖性的精确表达。通过将唯一的物理可能的root识别到立方方程,分析建立了问题是可以解决的。该模型提供了一个有吸引力的替代方案,以近似在物理和电气工程中的高级和第一年研究生级固态课程中涵盖了这一主题的标准课堂方法。将集成电路(IC)指定为在指定的温度限制之间运行。电路设计人员选择掺杂水平或水平,并且通常假设掺杂剂约为100%电离,即掺杂剂的耗尽,温度不太高。如果违反假设,则对诸如耗尽宽度或场效应晶体管(FET)阈值电压的耗尽宽度或场效应晶体管(FET)阈值电压可能存在显着影响。如果温度太低,掺杂剂或掺杂剂的百分比将显着小于100%。这种掺杂剂电离的高百分比的逆转通常称为冻结。大多数半导体器件和IC被设计成在耗尽方案中运行,也称为“外在制度”,参见图1,从B. Streetman的经典本科文本簿中借来,其中大多数载流子浓度大致等于掺杂剂浓度。 n {sub} d = 10 {sup} 15 / cm {sup} 3。同样,参考图1.如图1所示,如果温度太高,则热发电效果导致大多数载流子浓度变得过于掺杂剂在所谓的内在温度制度中。在内在的状态下,大多数载流量浓度大约是内在浓度,n {sub} i。疲惫的制度位于两个极端,内在和冻结之间。半导体设计师对多数载波的温度依赖感兴趣。如图1所示。如图1所示,该依赖性通常表示为大多数载流子浓度与温度倒数的对数。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号