The comparison of the thermal pattern and the deformation pattern both are obtained on the surface of Printed Circuit Board (PCB) was done to understand how both patterns correspond to each other. In the present study, both the FEMLAB simulator and Thermography were employed for the study. A Holographic Pattern Measuring System (HPMS) and an Interferometry Imaging System (IMS) were used. The test results showed that both thermal pattern and deformation pattern were different from each other. We found that we could not deduce the thermal deformed pattern on a PCB from its thermal pattern.
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