The Effect of SiC Surface Treatment on the Interface Bonding Behavior of SiC/Cu Composite Particles

摘要

In this work, in order to improve the wettability and physical and chemical compatibility between silicon carbide and copper, surface treatment techniques such as high-temperature oxidation, acid dipping and alkaline wash were adopted separately on silicon carbide particles, then Cu was coated on the surface of the silicon carbide particles by the replacement reaction method and decomposition reduction reaction method. It was found that, the surface of silicon carbide particle which treated by alkaline wash was cleaner and more rough than that only treated by high-temperature oxidation, moreover, the specific surface of the particle was increased, which resulted in a compact layer of Cu coating. For the same surface treatment particles, the effect of the Cu coating prepared by decomposition reaction method was better than that by reduction reaction method.