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On the Microstructure and Electrical Properties of Undoped and Antimony- Doped Tin Oxide Thin Film Deposited by Sol-Gel Process

机译:溶胶 - 凝胶工艺沉积未掺杂和锑掺杂氧化锡薄膜的微观结构和电性能

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Undoped and antimony-doped tin oxide (ATO) thin films were prepared by sol-gel process in the solution of metal salts of tin (Ⅱ) chloride dehydrate and antimony tri-chloride. The microstructure of the thin films was analyzed by scanning electron microscope (SEM) and X-ray diffraction (XRD). Compared with undoped tin oxide, doped antimony tin oxide films coated glass substrate were homogeneous in composition and morphology after being sintered at different temperatures. Electrical behavior of the doped films was discussed in terms of sheet resistance measured by four point probe. From the experimental data, the sheet resistance of the films could be as low as 100-200Ω/□.
机译:通过溶胶 - 凝胶工艺在锡(Ⅱ)氯化物脱水和锑三氯化物溶液中,通过溶胶 - 凝胶法制备未掺杂的和锑掺杂的氧化锡(ATO)薄膜。通过扫描电子显微镜(SEM)和X射线衍射(XRD)分析薄膜的微观结构。与未掺杂的氧化锡相比,掺杂锑锡氧化钛膜涂覆的玻璃基板在不同温度下烧结后的组成和形态均匀。通过四点探针测量的薄层电阻讨论了掺杂薄膜的电能。从实验数据中,薄膜的薄层电阻可以低至100-200Ω/□。

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