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Sn and Sn-Bi Alloy Plating Solution Development for High-speed Applications

机译:SN和SN-BI合金电镀液的高速应用溶液开发

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There have been many studies done on tin and tin alloy plating issues, ranging from simple acid sulphate and methanesulfonate electrolytes to their complicated mixtures. However, the problem of good electrolyte performance still remains in reel-to-reel high-speed applications today. There are also issues in relation to tin-bismuth alloy plating on alloy42 leadframes. Firstly, it is difficult to prevent bismuth immersion plating on the surface of tin anode and secondly, it is necessary to use a corrosion inhibitor for prevention similar displacement reaction on the surface of alloy42. This paper summarizes the study of effects of bath composition, temperature and additives in methanesulfonate electrolyte and performance characteristics of tin and tin-bismuth electrodeposits.
机译:在锡和锡合金电镀问题上进行了许多研究,从简单的酸硫酸盐和甲磺酸盐电解质到它们的复杂混合物。然而,今天的电解质性能良好的问题仍然仍然存在于今天的卷轴到卷轴高速应用中。还有关于Alloy42引线框架上的锡铋合金电镀的问题。首先,难以防止浸入锡阳极表面上的铋浸没电镀,其次是必须使用腐蚀抑制剂来预防合金42表面上的类似位移反应。本文总结了浴组合物,温度和添加剂在甲磺酸盐电解质和锡和锡铋电沉积物的性能特征中的影响研究。

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