ball grid arrays; plastic packaging; thermal stresses; life testing; finite element analysis; encapsulation; integrated circuit packaging; integrated circuit reliability; failure analysis; thermal cycling; accelerated testing; finite element analysis; PBGA; board level multiple environmental loading; long term reliability; plastic ball grid array packages; aerospace applications; nonunderfilled packages; underfilled packages; solder joint reliability; failure mode analysis; thermomechanical behavior; cyclic thermal loading; 3D FEA; time to failure;
机译:PBGA组件在等温/机械扭转载荷下的有限元分析
机译:结合振动测试和有限元分析来评估PBGA组件的疲劳寿命
机译:温度 - 车辆耦合负荷下液体沥青路面的机械响应:有限元模拟和加速路面试验研究
机译:多种环境载荷下PBGA的加速测试和有限元分析
机译:加速路面测试设备和车辙现象的有限元建模和分析。
机译:新型屈曲约束支架的循环载荷试验和有限元分析
机译:利用有限元分析加速可靠性试验的寿命估算
机译:钢制交通信号杆的荷载测试,有限元分析和设计