solders; tin alloys; silver alloys; copper alloys; bismuth alloys; eutectic alloys; ageing; crystal microstructure; crystal morphology; diffusion; lead-free solder; IMC growth rate sequence; solder interface; isothermal solder joint aging process; eutectic solder; quaternary solder; microstructure evolution; IMC growth kinetics; resistance oven; scallop-like morphology; planar morphology; atom diffusion; 145 to 155 degC; 50 hour; 100 hour; 250 hour; 500 hour; 1000 hour; SnAgCu; SnAgCuBi;
机译:Ni UBM与Sn-3Ag-0.5Cu和Sn-3.5Ag焊料凸点在时效过程中的IMC生长
机译:Ni和Co元素对Sn-3Ag-0.5Cu焊点界面IMC的形态和类型的影响
机译:IMC在SnAgCuBi(Bi = 0,5; 1,0)焊点与Cu衬底的界面处的生长
机译:Bi对时效过程中Sn-3Ag-0.5Cu焊料界面中IMC生长的影响
机译:在接近共晶的锡银铜焊料合金与金/镍金属化的界面处,金属间的形成和生长动力学。
机译:等温时效过程中超声焊接Cu / SAC305 / Cu结构的界面反应和IMC生长
机译:IMC在SnAgCuBi(Bi = 0,5; 1,0)焊点与Cu衬底的界面处的生长