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PRECISION COATING DEPOSITION TECHNIQUES FOR CONFORMAL COATING APPLICATIONS

机译:用于保形涂层应用的精密涂层沉积技术

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Precise control of coating deposition is critical to the application of conformal coatings to selected areas of printed circuit board assemblies. The coating must be applied in a defined pattern and film thickness to ensure that there is adequate coating present on areas to be coated such as soldered connections and no coating on other areas such as electrical connectors. In many cases, the areas to be coated are immediately adjacent to areas where coating cannot be applied (no-coat areas). Automated coating application techniques are increasingly being utilized to replace the less controllable hand spray and dipping techniques for conformal coating application. Some new coating application methods include air-atomized spray, film coating and ultrasonic atomized spray. In recent years, automated systems have been developed for the application of coatings with the goal of eliminating the masking and de-masking process. These systems typically consist of a coating applicator for large areas, a coating applicator for small areas, a motion and positioning mechanism for the coating applicators and a system controller. Typically spray valves or film coating applicators are used for coating the large areas on the substrate quickly to minimize the time required for coating application. However, typical large area coating applicators deposit the coating pattern with irregular edges. The coating cannot be applied close to the no-coat areas with these applicators due to the irregular edge of the coating pattern. In order to eliminate masking another applicator is required to coat the smaller areas immediately adjacent to the no-coat areas. These types of applicators have been effective in certain circumstances but do not produce a uniform coating and do not completely eliminate the requirement for masking. Limitations of dispensing applicators include imprecise flow rate control, difficulty producing short coating line segments, heavy coating deposition at the start and end of a coating segment and susceptibility to uneven or warped substrate surfaces. The coating flow rate from a dispensing valve is set with a manual screw to adjust the stroke of a piston that is connected to a needle. The distance that the needle moves from the seat controls the effective orifice size at the nozzle tip and thus the flow rate of the coating. This manual adjustment is subjective and will necessarily produce different results each time the valve is adjusted. The needle and seat arrangement of dispensing valves produces discontinuities as the flow starts and stops. This flow behavior coupled with the head motion profile tends to produce heavy spots at the start and end of a coating segment and makes it difficult to create a short coating segment. Programming techniques can somewhat overcome this effect, but the process can be tedious and difficult to repeat. To apply coatings to very small areas or in straight lines with a dispensing valve, an external dispensing needle is required. To achieve optimal results, the outlet of the needle must be very close to the substrate, typically within 1 mm. If the substrate is uneven or slightly warped coating skips may result due to the changing distance between the needle and substrate. Additionally, the needle has a tendency to contact previously applied coating and pull it along with it causing skips and smears. The needle is also subject to being damaged if it comes into contact with the substrate. An automated method for the precise application of conformal coatings has been developed that utilizes the combination of a dual mode “nozzle-less” ultrasonic spray head, a precision digital dispensing head and a precision XY-^sZ-θ-? motion control platform. The ultrasonic spray head uses ultrasonic energy to break the liquid into small drops to form the spray, but the liquid does not pass through the ultrasonic device. The liquid is applied externally, to a solid surface, vibrating at an ultrasonic frequency (> 20 kHz).
机译:精确控制涂层沉积对于将共形涂层施加到印刷电路板组件的选定区域至关重要。涂层必须以限定的图案和膜厚度施加,以确保存在于待涂覆的区域上存在的足够涂层,例如焊接连接,并且在其他区域上没有涂层,例如电连接器。在许多情况下,要涂覆的区域立即与不能施加涂层的区域(无涂层区域)相邻。越来越多地利用自动涂层应用技术来代替适用于保形涂层应用的可控手动喷射和浸渍技术。一些新的涂料施用方法包括空气雾化喷涂,薄膜涂层和超声雾化喷雾。近年来,已经开发了自动化系统,用于应用涂层,目的是消除掩蔽和去掩蔽过程。这些系统通常包括用于大面积的涂层涂敷器,用于小区域的涂料涂敷器,用于涂层涂敷器的运动和定位机构和系统控制器。通常,喷雾阀或薄膜涂料涂布器用于快速涂覆基板上的大区域以使涂层应用所需的时间最小化。然而,典型的大面积涂层涂布器用不规则边缘沉积涂层图案。由于涂布图案的不规则边缘,不能靠近无涂层区域靠近无涂层区域施加。为了消除掩模,需要另外的涂抹器来涂覆紧邻无涂层区域的较小区域。这些类型的涂抹器在某些情况下已经有效,但不会产生均匀的涂层,并且不会完全消除掩蔽的要求。分配施加器的限制包括不精确的流量控制,难以在涂覆片段的起始和结束时产生短涂层线段,重涂层沉积和对不均匀或翘曲的基板表面的敏感性。来自分配阀的涂布流量用手动螺钉设定,以调节连接到针的活塞的行程。针从座椅移动的距离控制喷嘴尖端处的有效孔口尺寸,从而控制涂层的流速。本手动调整是主观的,并且每次调整阀门时都必须产生不同的结果。当流动开始和停止时,分配阀的针和座椅布置产生不连续性。与头部运动轮廓耦合的该流动倾向于在涂布段的开始和结束处产生重斑,并且难以产生短涂层段。编程技术可以有点克服这种效果,但过程可能会乏味且难以重复。为了将涂层涂覆到非常小的区域或用分配阀的直线,需要外部分配针。为了实现最佳结果,针的出口必须非常靠近基板,通常在1mm内。如果基板是不均匀的或略微翘曲的涂布,则由于针和基板之间的距离变化而导致跳过。另外,针具有与预先施加的涂层接触并将其拉动其引起跳过和涂抹的趋势。如果与基板接触,则针也受损。已经开发了一种精确地施加保形涂层的自动化方法,其利用双模“喷嘴”超声波喷头,精密数字分配头和精密XY-^ SZ-θ-的组合。运动控制平台。超声波喷头使用超声波能量将液体破碎成小滴以形成喷雾,但液体不会通过超声波装置。将液体在外部施加到固体表面,以超声波频率(> 20kHz)振动。

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