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Root-Cause Analysis and Statistical Process Control of Epilayers for SiGe:C Hetero-Structure Bipolar Transistors

机译:SiGe:C杂结构双极晶体管的根本原因分析及统计过程控制

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The SiGe:C hetero-structure bipolar transistor (HBT) has turned into a key technology for wireless communication. This paper describes various critical analytical techniques to bring up and maintain the SiGe:C epi-process. Two types of analysis are critical, (1) routine monitoring SiGe base and Si cap thickness, doping dose, Ge composition profile, and their uniformity across the wafer; and (2) root-cause analysis on problems due to non-optimized process and variation in process conditions. A transmission electron microscopy (TEM) technique has been developed allowing a thickness measurement with a reproducibility better than 3 A. Charge-compensated low-energy secondary ion mass spectrometry (SIMS) using optical conductivity enhancement (OCE) allows a Ge composition measurement to a required precision of 0.5 at.%.
机译:SiGe:C杂结构双极晶体管(HBT)变成了无线通信的关键技术。本文介绍了各种临界分析技术,以培养和维持SiGe:C EPI-Process。两种类型的分析是关键的,(1)常规监测SiGe基础和Si帽厚度,掺杂剂量,GE成分型材,以及晶圆上的均匀性; (2)根本原因分析问题由于未优化过程和过程条件的变化。已经开发了一种透射电子显微镜(TEM)技术,允许使用比3 A的再现性的厚度测量。使用光导增强(OCE)的电荷补偿的低能量二次离子质谱(SIMS)允许GE组合测量到A所需精度为0.5 at。%。

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