首页> 外文会议>2003 International Conference on Characterization and Metrology for ULSI Technology; Mar 24-28, 2003; Austin, Texas >Root-Cause Analysis and Statistical Process Control of Epilayers for SiGe:C Hetero-Structure Bipolar Transistors
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Root-Cause Analysis and Statistical Process Control of Epilayers for SiGe:C Hetero-Structure Bipolar Transistors

机译:SiGe:C异质结构双极晶体管外延层的根本原因分析和统计过程控制

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The SiGe:C hetero-structure bipolar transistor (HBT) has turned into a key technology for wireless communication. This paper describes various critical analytical techniques to bring up and maintain the SiGe:C epi-process. Two types of analysis are critical, (1) routine monitoring SiGe base and Si cap thickness, doping dose, Ge composition profile, and their uniformity across the wafer; and (2) root-cause analysis on problems due to non-optimized process and variation in process conditions. A transmission electron microscopy (TEM) technique has been developed allowing a thickness measurement with a reproducibility better than 3 A. Charge-compensated low-energy secondary ion mass spectrometry (SIMS) using optical conductivity enhancement (OCE) allows a Ge composition measurement to a required precision of 0.5 at. %.
机译:SiGe:C异质结构双极晶体管(HBT)已成为无线通信的一项关键技术。本文介绍了各种重要的分析技术,以提出和维护SiGe:C Epi工艺。两种类型的分析至关重要:(1)常规监测SiGe基极和Si盖厚度,掺杂剂量,Ge组成分布及其在整个晶圆上的均匀性; (2)对由于工艺未优化和工艺条件变化而引起的问题进行根本原因分析。已开发出一种透射电子显微镜(TEM)技术,该技术可以进行厚度再现性优于3 A的测量。使用光导率增强(OCE)的电荷补偿低能二次离子质谱(SIMS)可以测量Ge到要求的精度为0.5 at。 %。

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