Soldering Joint of TZM/NbTi/Graphite

摘要

In order to improve high temperature property of the joint, TZM and graphite was jointed by using Nb-Ti solder material at different temperatures. Cross-sectional observation and EPMA analysis were carried out to evaluate the joint. Mo does not diffuse to solder material at low jointing temperature. However, diffusion of Mo to solder was significantly observed at high jointing temperature. Ti-rich dendritic TiC-Nb-C solid solution layer was formed at graphite side. This layer shows high hardness. Diffusion of Mo from TZM arrests growing of the layer at soldering temperature above 1800°C.