Poled plasma polymers to produce stable on chip modulators for chip to chip optical interconnect

摘要

Applications requiring high bandwidth communication are now envisioned on the system level where processor to processor and processor to memory interconnection will require hundreds or thousand of high speed data communication paths. The advantages of optical communication are inevitably proceeding to this level with CMOS compatible photonic integration required for chip to chip interconnection. Microelectronic CMOS fabrication has proceeded at a rapid rate following Moore's Law. However, beyond the handful of materials used in CMOS fabrication are other materials and fabrication processes that provide the possibility of chip to chip optical interconnection more rapidly and cost effectively than possible in the restricted CMOS materials. Organic materials have demonstrated superior capabilities to the CMOS materials in photonic applications. Further, they possess the ability to integrate with CMOS processing to capitalize on the ability of silicon based microelectronics to produce low cost, optically interconnected CMOS microelectronic devices.