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Flux-Less/Void-Free: An Environmentally Friendly Soldering Process for Microelectronics Assemblies

机译:无芯/无效:无环保焊接过程,用于微电子组件

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摘要

The microelectronics industry is seeing a growing challenge as it continues to miniaturize. Microelectronics systems have placed an important focus on the science and art of packaging of these devices. Imagine designing without a concern about the size or pitch of components or solder balls. There are limits, but it would be nice to push those limits. Flux-free soldering can give the industry that freedom. Of course, flux-free soldering along with the added benefit of a void-free solder joint makes this technique even more beneficial. No flux means no solder bridging, no contamination and no cleaning for starters.
机译:微电子工业正在看到越来越大的挑战,因为它继续小型化。微电子系统对这些设备的包装的科学和艺术进行了重要焦点。想象一下,在没有担心组件或焊球的尺寸或间距的关注。有限制,但推动这些限制很好。无芯焊接可以为行业提供自由。当然,无磁通焊接以及无空隙焊点的额外益处使得该技术更有益。没有助焊剂意味着没有焊接桥接,没有污染,初学者没有清洁。

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