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Compact multi/demultiplexer system consisting of stacked dielectric interference filters and aspheric lenses

机译:紧凑的多/多路分解器系统,包括堆叠介电干涉过滤器和非球面镜头

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We report both system design and experimental evaluation of SMOP (Simple and small Multi/demultiplexer consisting of Optical elements) system used for intra-cabinet-level optical interconnections. To increase the interconnection bandwidth, wavelength division multiplexing (WDM) is an important technology. However, dense WDM is not suitable for the intra-cabinet-level interconnections due to its system complexity and expensive production cost. Instead, we chose wide-channel-spacing wavelength division multiplexing (WWDM) since it is expected to reduce fabrication cost by using uncooled lasers. The SMOP consists of three dielectric interference filters and a reflecting mirror, and aspheric lenses. The lens array pitch is set to be 0.25mm to fit the optical fiber pitch at the end facet of MT connecters. Three dielectric interference filters are stacked to perform wavelength multiplexing and demultiplexing functionalities. An incident signal light from an MT connector with four different wavelengths (1280nm, 1300nm, 1320nm, 1340nm) is first collimated and deflected by an off-axius collimator lens. Three layers of dielectric filters differentiate different wavelengths by reflecting the incident beam at different locations. The SMOP is packaged as small as 6.4nm by 2.5nm with 8.1nm thickness small enough for the intra-cabinet-level interconnections. The proto-type experiments confirmed low insertion loss of below 5dB. The proposed wafer-level fabrication of SMOP may be effective in packaging such applications.
机译:我们报告了用于内部级光学互连的SMOP(简单和小型多/多路分解器的系统设计和实验评估,用于内部级光学互连。为了增加互连带宽,波分复用(WDM)是重要的技术。然而,由于其系统复杂性和昂贵的生产成本,致密的WDM不适用于内部内部互连。相反,我们选择了宽通道间距波分复用(WWDM),因为预期通过使用未冷却激光器降低制造成本。 SMOP由三个介电干涉过滤器和反射镜和非球面镜片组成。透镜阵列间距设定为0.25mm,以适合Mt连接器的端面处的光纤间距。堆叠三个介电干涉滤波器以执行波长复用和多路分解功能。来自具有四个不同波长(1280nm,1300nm,1320nm,1340nm)的MT连接器的入射信号光首先由Off-Axius准直透镜直接和偏转。通过在不同位置反射入射光束来区分三层介电滤波器来区分不同的波长。将SMOP打包为6.4nm,径向8.1nm,足够小,足以用于内部内部互连。原型实验证实低插入损耗低于5dB。所提出的SMOP的晶片级制造可以有效地包装这些应用。

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