Understanding Whisker Phenomenon - Driving Force For The Whisker Formation

摘要

The physical, chemical and structural properties of electroplated Sn and whiskers are studied using various techniques including X-Ray diffraction (XRD), Focussed Ion Beam (FIB), 5 canning Auger microscopy (SAM) and SEM/EDS. From the results of these studies we conclude that the driving force for the whisker formation is the compressive stress in the Sn coating. The tensile stress in the Sn coating, on the other hand, will hinder the whisker formation. This understanding provides the foundation for the whisker prevention remedies, which we offer to the electronic industry.