Fusion Splicing For Optoelectronic Assembly

摘要

With increasing bandwidth demands required for data communications, the use of optical data transmission has become increasingly important. As optics and electronics continue to merge, the rapid entrance of new technologies and processes presents further challenges to the EMS provider. While a major role of the EMS provider continues to be product assembly, the processes and technologies required for optoelectronic products have additional requirements. Analogous to processing of printed circuit assemblies (PCA), today one must also address the challenges of optical interconnects. Performance and density requirements have driven the need for fusion splicing optical fiber. This paper provides insight into a relatively new area of interest for the manufacturer, the fusion splicing process. More specifically, the evaluation of manufacturing equipment, key parameters requiring measurement and testing techniques, as well as future trends, are discussed.